Component News February 17, 2020
Electronic Component Industry News: January News Update

Electronic Component Industry News: January News Update

The latest news, developments and announcements from around the electronics industry.

HiSilicon is no longer exclusively supplying chips to Huawei

HiSilicon, a subsidiary of Huawei and the largest Chinese IC design company, has exclusively designed and supplied chips for Huawei.  However, at ELEXCON, HiSilicon announced that they’ve launched 4G communication chips on the open market.  According to reports, Shanghai HiSilicon will sell chips to the open market while Shenzhen HiSilicon will be supplying chips to the parent company.

Microchip Technology cutting jobs at its Colorado Springs plant

Microchip Technology, an Arizona based semiconductor manufacturer, announced it plans to cut 200-275 jobs from their Colorado Springs plant during the first quarter of 2020.  While this move was made in the interest of streamlining the plant, it will reduce their workforce from 800 to just over 500 people.  Dan Malinaric, Microchip’s vice president, has said that the reductions are a combination of layoffs, voluntary resignations, and transfers.  As most of the manufacturing has shifted overseas, Microchip stated that they believe they are the last computer chipmaker in Colorado Springs.

Global PC shipments grew for the Fourth Quarter and entire year

After seven consecutive years of decline, worldwide PC shipments have seen their first sign of growth.  Gartner,  a global research and advisory firm, says Worldwide PC Shipments Grew 2.3% in 4Q19 and 0.6% for the Year.  According to their preliminary results, shipments totaled 70.6 million units in the fourth quarter of 2019 and 261 million units for the entire year.  This growth is a result of the growing demand for Windows 10 upgrades and is expected to continue through 2020.  Despite the Intel CPU shortage, the top 3 chipmakers have seen growth in their combined market share through 2019 and will likely continue to reap the benefits of the increase in PC shipments.

Rohde & Schwarz selects Benchmark Electronics as a global manufacturing partner

Since Rohde & Schwarz’ German plants in Teisnach and Memmingen, and their Czech Republic plant in Vimperk have been working at full capacity, the company has been seeking additional production capacities to continue its recent growth.  This led them to the decision to meet their needs by expanding their long-term contract with Benchmark Electronics.  Dr. Marc Sesterhenn, Executive Vice President Operations at Rohde & Schwarz, said: “As an existing Benchmark engineering services customer, we were very familiar with Benchmark’s capabilities, global footprint and technical expertise.

Integrated Device Technology to start operations as Renesas Electronics

Renesas Electronic Corporation has announced that following the successful integration of Integrated Device Solutions, Inc. in the U.S., IDT began operating in the market under the name of Renesas Electronics America Inc. as of January 1, 2020.  President and CEO of Renesas Electronics Corporation said “Fueled by the IDT integration, Renesas is now poised to further accelerate its business strategies and extend its share in fast-growing data economy-related markets such as infrastructure and data center, and strengthen its presence in the industrial and automotive segments”.  Former IDT products are rebranded as Renesas products from January 2020 onwards.


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